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— | Compared to competitors’ multi-layered plated films, manufacturing method using minimum layer sputtering method secures unit price competitiveness |
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— | Improvement of quality reliability due to decrease of defect factors such as void delamination at Cu/Sn interface |
— | Future market response and application scalability with granular size PCSB (minimum size >4um) versus competitive PCSB |
Application : Semiconductor Wafer Bumping RDL/UBM Process Cu Plating Process Cu Plating Equipment Composition Wafer Cu Plating Equipment 3D Design – Composition:
Screening/Radiator Film — Shielding/heat radiation film deposition — Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying