We are Creating · Co-working · Contributing
We are Creating · Co-working · Contributing
R to R Plating
R to R Plating
| — | Electrolytic and chemical reactions to the film surface in a plating solution |
|---|---|
| — | Plating of Laser Hall (PTH) in FPCB-circuit |
| — | Spacial Layer Plating of FCCL |
| — | Circuit diagram of touch panel |
| — | Uniform sheet metal thickness control (0.15 μm ~ 200 μm ± 10%) |
| — | Control of plated film quality (green size, Roughness, etc.) |
| — | Plating can be done on both sides |
Other Services
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EMI Shield Sputter
Basic Configuration of Sputter (1Chamber) — Sputtering Chamber + Carrier L/UL(Vacuum/Standby) + Baking Chamber + Cassette L/UL 01. Cassette L/UL02. Carrier L/UL
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Wafer Plating
Application : Semiconductor Wafer Bumping RDL/UBM Process Cu Plating Process Cu Plating Equipment Composition Wafer Cu Plating Equipment 3D Design – Composition:
