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— | Compared to competitors’ multi-layered plated films, manufacturing method using minimum layer sputtering method secures unit price competitiveness |
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— | Improvement of quality reliability due to decrease of defect factors such as void delamination at Cu/Sn interface |
— | Future market response and application scalability with granular size PCSB (minimum size >4um) versus competitive PCSB |
R to R Plating — Electrolytic and chemical reactions to the film surface in a plating solution — Plating of Laser Hall
Simultaneous metal deposition on 3 sides of display board (side wiring technology) — Product Application ㆍSubstrate side wiring TV ㆍSubstrate/Ball/Deposition Simultaneous metal