Plastic Cored Solder Ball

Plastic Cored Solder Ball

— Solder ball for semiconductor packaging(Plastic Cored Solder Ball)

Compared to competitors’ multi-layered plated films, manufacturing method using minimum layer sputtering method secures unit price competitiveness
Improvement of quality reliability due to decrease of defect factors such as void delamination at Cu/Sn interface
Future market response and application scalability with granular size PCSB (minimum size >4um) versus competitive PCSB
TETOS Solder Ball structure

ㆍCompetitive Solder Ball structure

Other Services

  • Glass side wiring for display

    Simultaneous metal deposition on 3 sides of display board (side wiring technology) — Product Application ㆍSubstrate side wiring TV ㆍSubstrate/Ball/Deposition Simultaneous metal

  • R to R Sputter

    R to R Sputter — Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers — Performance is given to