We are Creating · Co-working · Contributing
We are Creating · Co-working · Contributing
Wafer Plating
Application : Semiconductor Wafer Bumping RDL/UBM Process
Cu Plating Process
Cu Plating Equipment Composition
Wafer Cu Plating Equipment 3D Design
– Composition: Plating/Rinse Bath, Control, Wafer Load/Unload.
— Main Features of Plating Equipment
| — | High-speed Thick RDL Plating up to 1.5 -> 3ASD |
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| — | Automatic continuous plating of 6 wafers /1 time. (Loading : Manual) |
| — | Plating of small quantity multi-variety. (Simultaneous application of recipe to 1~6 products) |
| — | Manufacturing of plating solution-saving batch structure |
| — | Jig production and repair available in Korea |
| — | Domestic production, domestic/overseas setup, quick A/S |
— TETOS Plating Equipment Advantage
| — | Secure the quality equal to that of existing Cu plating companies based on FPCB Cu deposition/plating experience. In particular, excellent Cpk management even under the thick Cu RLD plating condition with regard to Power Device. |
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| — | Customized equipment design and manufacture according to customer requirements as well as setup of plating conditions in connection with plating solution companies. |
Other Services
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Plastic Cored Solder Ball
Plastic Cored Solder Ball — Solder ball for semiconductor packaging(Plastic Cored Solder Ball) — Compared to competitors’ multi-layered plated films, manufacturing method
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R to R Sputter
R to R Sputter — Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers — Performance is given to
