|—||High-speed Thick RDL Plating up to 1.5 -> 3ASD|
|—||Automatic continuous plating of 6 wafers /1 time. (Loading : Manual)|
|—||Plating of small quantity multi-variety. (Simultaneous application of recipe to 1~6 products)|
|—||Manufacturing of plating solution-saving batch structure|
|—||Jig production and repair available in Korea|
|—||Domestic production, domestic/overseas setup, quick A/S|
|—||Secure the quality equal to that of existing Cu plating companies based on FPCB Cu deposition/plating experience.
In particular, excellent Cpk management even under the thick Cu RLD plating condition with regard to Power Device.
|—||Customized equipment design and manufacture according to customer requirements as well as setup of plating conditions in connection with plating solution companies.|
Plastic Cored Solder Ball — Solder ball for semiconductor packaging(Plastic Cored Solder Ball) — Compared to competitors’ multi-layered plated films, manufacturing method
R to R Sputter — Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers — Performance is given to