We are Creating · Co-working · Contributing
We are Creating · Co-working · Contributing
Plastic Cored Solder Ball
Plastic Cored Solder Ball
— Solder ball for semiconductor packaging(Plastic Cored Solder Ball)
| — | Compared to competitors’ multi-layered plated films, manufacturing method using minimum layer sputtering method secures unit price competitiveness |
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| — | Improvement of quality reliability due to decrease of defect factors such as void delamination at Cu/Sn interface |
| — | Future market response and application scalability with granular size PCSB (minimum size >4um) versus competitive PCSB |
ㆍTETOS Solder Ball structure
ㆍCompetitive Solder Ball structure
Other Services
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EMI Shield Sputter
Basic Configuration of Sputter (1Chamber) — Sputtering Chamber + Carrier L/UL(Vacuum/Standby) + Baking Chamber + Cassette L/UL 01. Cassette L/UL02. Carrier L/UL
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R to R Plating
R to R Plating — Electrolytic and chemical reactions to the film surface in a plating solution — Plating of Laser Hall
