We are Creating · Co-working · Contributing
We are Creating · Co-working · Contributing
Plastic Cored Solder Ball
Plastic Cored Solder Ball
— Solder ball for semiconductor packaging(Plastic Cored Solder Ball)
| — | Compared to competitors’ multi-layered plated films, manufacturing method using minimum layer sputtering method secures unit price competitiveness |
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| — | Improvement of quality reliability due to decrease of defect factors such as void delamination at Cu/Sn interface |
| — | Future market response and application scalability with granular size PCSB (minimum size >4um) versus competitive PCSB |
ㆍTETOS Solder Ball structure
ㆍCompetitive Solder Ball structure
Other Services
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Wafer Plating
Application : Semiconductor Wafer Bumping RDL/UBM Process Cu Plating Process Cu Plating Equipment Composition Wafer Cu Plating Equipment 3D Design – Composition:
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R to R Sputter
R to R Sputter — Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers — Performance is given to
