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| — | Electrolytic and chemical reactions to the film surface in a plating solution |
|---|---|
| — | Plating of Laser Hall (PTH) in FPCB-circuit |
| — | Spacial Layer Plating of FCCL |
| — | Circuit diagram of touch panel |
| — | Uniform sheet metal thickness control (0.15 μm ~ 200 μm ± 10%) |
| — | Control of plated film quality (green size, Roughness, etc.) |
| — | Plating can be done on both sides |
Plastic Cored Solder Ball — Solder ball for semiconductor packaging(Plastic Cored Solder Ball) — Compared to competitors’ multi-layered plated films, manufacturing method
Screening/Radiator Film — Shielding/heat radiation film deposition — Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying