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| — | Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying the layer. |
|---|---|
| — | Increased reliability of semiconductor components by immersing non-plating products with a sputter |
| — | Sputter method without transformation of raw material for various parts |
Simultaneous metal deposition on 3 sides of display board (side wiring technology) — Product Application ㆍSubstrate side wiring TV ㆍSubstrate/Ball/Deposition Simultaneous metal
Plastic Cored Solder Ball — Solder ball for semiconductor packaging(Plastic Cored Solder Ball) — Compared to competitors’ multi-layered plated films, manufacturing method