We are Creating · Co-working · Contributing
We are Creating · Co-working · Contributing
Screening/Radiator Film
Screening/Radiator Film
— Shielding/heat radiation film deposition
| — | Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying the layer. |
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| — | Increased reliability of semiconductor components by immersing non-plating products with a sputter |
| — | Sputter method without transformation of raw material for various parts |
ㆍTETOS Product Structure (Sputter based)
ㆍA picture of a PU membrane sputter sample
Other Services
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EMI Shield Sputter
Basic Configuration of Sputter (1Chamber) — Sputtering Chamber + Carrier L/UL(Vacuum/Standby) + Baking Chamber + Cassette L/UL 01. Cassette L/UL02. Carrier L/UL
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Wafer Plating
Application : Semiconductor Wafer Bumping RDL/UBM Process Cu Plating Process Cu Plating Equipment Composition Wafer Cu Plating Equipment 3D Design – Composition:
