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— | Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying the layer. |
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— | Increased reliability of semiconductor components by immersing non-plating products with a sputter |
— | Sputter method without transformation of raw material for various parts |
Plastic Cored Solder Ball — Solder ball for semiconductor packaging(Plastic Cored Solder Ball) — Compared to competitors’ multi-layered plated films, manufacturing method
Application : Semiconductor Wafer Bumping RDL/UBM Process Cu Plating Process Cu Plating Equipment Composition Wafer Cu Plating Equipment 3D Design – Composition: