Contact Us
| — | Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying the layer. |
|---|---|
| — | Increased reliability of semiconductor components by immersing non-plating products with a sputter |
| — | Sputter method without transformation of raw material for various parts |
R to R Sputter — Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers — Performance is given to
Simultaneous metal deposition on 3 sides of display board (side wiring technology) — Product Application ㆍSubstrate side wiring TV ㆍSubstrate/Ball/Deposition Simultaneous metal