Contact Us
— | Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying the layer. |
---|---|
— | Increased reliability of semiconductor components by immersing non-plating products with a sputter |
— | Sputter method without transformation of raw material for various parts |
Basic Configuration of Sputter (1Chamber) — Sputtering Chamber + Carrier L/UL(Vacuum/Standby) + Baking Chamber + Cassette L/UL 01. Cassette L/UL02. Carrier L/UL
Simultaneous metal deposition on 3 sides of display board (side wiring technology) — Product Application ㆍSubstrate side wiring TV ㆍSubstrate/Ball/Deposition Simultaneous metal