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| — | Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying the layer. |
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| — | Increased reliability of semiconductor components by immersing non-plating products with a sputter |
| — | Sputter method without transformation of raw material for various parts |
R to R Plating — Electrolytic and chemical reactions to the film surface in a plating solution — Plating of Laser Hall
Basic Configuration of Sputter (1Chamber) — Sputtering Chamber + Carrier L/UL(Vacuum/Standby) + Baking Chamber + Cassette L/UL 01. Cassette L/UL02. Carrier L/UL