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Status | Date of Publication | Patent no. | Title of the Invention | |
---|---|---|---|---|
Registration | 2014-08-21 | 10-1435357 | Method for CCL using fine pitch pattern | |
Registration | 2016-01-14 | 10-1584916 | Manufacturing method for solder resister | |
Registration | 2016-01-29 | 10-1591737 | Method for manufacturing filler and method for manufacturing adhesive composition having heat dissipation | |
Registration | 2016-02-11 | 10-1595182 | Method for manufacturing the conductive polymer ball | Solderball |
Registration | 2016-03-28 | 10-1608594 | Plating equipment with no contact dipping roller and method using same | |
Registration | 2013-08-29 | 10-1303590 | Complex conductive substrate and method of manufacturing thereof | FPCB Plating Equipment |
Registration | 2018-02-06 | 10-1828311 | Sputtering apparatus for conductive particles | Solderball |
Registration | 2018-02-06 | 10-1435357 | A method of sputtering conductive particles and conductive particles | Solderball |
Registration | 2018-05-03 | 10-1856623 | Method of sputtering reflective particles, reflective particles and reflector comprising same | |
Registration | 2018-06-22 | 10-1872305 | Metal ball manufacturing apparatus and manufacturing method thereof | Solderball |
Registration | 2018-07-10 | 10,020,274 | USA_Solderball (Overseas application_PCSB) | Solderball |
Registration | 2018-06-29 | 10-1875066 | Method for manufacturing a camera shake correcting coil unit and a camera shake correcting coil unit | |
Registration | 2018-07-06 | 10-1877931 | Manufacturing method for solder particle and solder particle | Solderball |
Registration | 2018-07-25 | 10-1883727 | EMI shielding particle, EMI shielding composite including the EMI shielding particle, EMI shielding adhesive film including the EMI shielding composite and apparatus including the EMI shielding composite | |
Registration | 2018-07-25 | 10-1883728 | Multi layer structure for electromagnetic interference shield and method for manufacturing a multi layer structure for electromagnetic interference shield | EMI Shield Film |
Registration | 2018-11-28 | 10-1924857 | Thermal conductive particle | |
Registration | 2012-05-31 | 10-1153934 | Molecular beam evaporation source for vacuum thin film deposition with integral heating unit, method of manufacturing the same, and evaporator | |
Registration | 2018-04-25 | 10-2018-0048025 | Manufacturing Method of Metal Ball | Solderball |
Registration | 2019-10-18 | 6601778 | Japan_Solderball (Overseas application_PCSB) | Solderball |
Registration | 2020-07-16 | 10-12136701 | Roll-to-roll sputtering equipment | Double-sided sputter equipment |
Registration | 2020-08-25 | 10-2149680 | Substrate side deposition apparatus | Micro LED Side Wiring |
Registration | 2020-09-17 | 10-2149680 | Wafer Plating System | Wafer Plating Equipment |
Registration | 2020-09-22 | 10-2160500 | Method of forming wiring on side surface of substrate | Micro LED Side Wiring |
Registration | 2020-11-11 | 10-2182584 | LED display module | Micro LED Side Wiring |
Registration | 2020-11-11 | 10-2179671 | A substrate side deposition apparatus having a substrate mounting drum with improved cooling efficiency | Micro LED Side Wiring |
Registration | 2020-11-11 | 10-2179672 | Method of forming wiring on side surface of substrate | Micro LED Side Wiring |
Registration | 2020-12-09 | 10-2191323 | Automated substrate side deposition method | Micro LED Side Wiring |
Registration | 2020-12-02 | 10-2188372 | Substrate both sides deposition apparatus(2) | Micro LED Side Wiring |
Registration | 2020-12-02 | 10-2188373 | Substrate both sides deposition apparatus(3) | Micro LED Side Wiring |
Registration | 2020-12-31 | 10-2199602 | Exposure device for formation of substrate circuit pattern | Micro LED Side Wiring |
Registration | 2021-01-20 | 10-2207602 | Method of forming wiring on side surface of substrate | Micro LED Side Wiring |
Registration | 2021-03-04 | 10-2225985 | Automated substrate side deposition apparatus | Micro LED Side Wiring |
Registration | 2021-03-04 | 10-2225986 | Substrate side deposition apparatus(1) | Micro LED Side Wiring |
Registration | 2021-03-30 | 10,964,868 | USA_Patent3(LED display module) | Micro LED Side Wiring |
Registration | 2021-03-30 | 10,964,509 | USA_Patent2(Substrate side deposition apparatus) | Micro LED Side Wiring |
Registration | 2021-07-02 | 10-2274884 | Roll-to-roll sputtering equipment | Double-sided sputter equipment |
Registration | 2021-02-26 | 6843445 | Japan_Patent1(Method of forming wiring on side surface of substrate) | Micro LED Side Wiring |
Registration | 2021-04-27 | 6875750 | Japan_Patent2(Substrate side deposition apparatus) | Micro LED Side Wiring |
Registration | 2021-03-16 | 6853588 | Japan_Patent3(LED display module) | Micro LED Side Wiring |
Registration | 2021-06-01 | 6892713 | Japan_Patent6(Substrate Both Sides Deposition Apparatus) | Micro LED Side Wiring |
Registration | 2021-07-01 | I732530 | Taiwan_Patent5(Method of forming wiring on side surface of substrate) | Micro LED Side Wiring |
Registration | 2021-08-24 | 11,098,401 | USA_Patent1(Method of forming wiring on side surface of substrate) | Micro LED Side Wiring |
Registration | 2021-10-01 | ZL201910693671.3 | China_Patent2(Substrate side deposition apparatus) | Micro LED Side Wiring |
Registration | 2021-09-27 | 6949381 | Japan_Patent4(A device for depositing a metal film on a surface of a three-dimensional object) | Semiconductor IC EMI Shield |
Registration | 2021-08-21 | I737264 | Taiwan_Patent6(Substrate Both Sides Deposition Apparatus) | Micro LED Side Wiring |
Registration | 2021-11-30 | 11,186,907 | USA_Patent6(Substrate Both Sides Deposition Apparatus) | Micro LED Side Wiring |