Patent Status

Patent registration and application status

Status Date of Publication Patent no. Title of the Invention
Registration 2014-08-21 10-1435357 Method for CCL using fine pitch pattern
Registration 2016-01-14 10-1584916 Manufacturing method for solder resister
Registration 2016-01-29 10-1591737 Method for manufacturing filler and method for manufacturing adhesive composition having heat dissipation
Registration 2016-02-11 10-1595182 Method for manufacturing the conductive polymer ball Solderball
Registration 2016-03-28 10-1608594 Plating equipment with no contact dipping roller and method using same
Registration 2013-08-29 10-1303590 Complex conductive substrate and method of manufacturing thereof FPCB Plating Equipment
Registration 2018-02-06 10-1828311 Sputtering apparatus for conductive particles Solderball
Registration 2018-02-06 10-1435357 A method of sputtering conductive particles and conductive particles Solderball
Registration 2018-05-03 10-1856623 Method of sputtering reflective particles, reflective particles and reflector comprising same
Registration 2018-06-22 10-1872305 Metal ball manufacturing apparatus and manufacturing method thereof Solderball
Registration 2018-07-10 10,020,274 USA_Solderball (Overseas application_PCSB) Solderball
Registration 2018-06-29 10-1875066 Method for manufacturing a camera shake correcting coil unit and a camera shake correcting coil unit
Registration 2018-07-06 10-1877931 Manufacturing method for solder particle and solder particle Solderball
Registration 2018-07-25 10-1883727 EMI shielding particle, EMI shielding composite including the EMI shielding particle, EMI shielding adhesive film including the EMI shielding composite and apparatus including the EMI shielding composite
Registration 2018-07-25 10-1883728 Multi layer structure for electromagnetic interference shield and method for manufacturing a multi layer structure for electromagnetic interference shield EMI Shield Film
Registration 2018-11-28 10-1924857 Thermal conductive particle
Registration 2012-05-31 10-1153934 Molecular beam evaporation source for vacuum thin film deposition with integral heating unit, method of manufacturing the same, and evaporator
Registration 2018-04-25 10-2018-0048025 Manufacturing Method of Metal Ball Solderball
Registration 2019-10-18 6601778 Japan_Solderball (Overseas application_PCSB) Solderball
Registration 2020-07-16 10-12136701 Roll-to-roll sputtering equipment Double-sided sputter equipment
Registration 2020-08-25 10-2149680 Substrate side deposition apparatus Micro LED Side Wiring
Registration 2020-09-17 10-2149680 Wafer Plating System Wafer Plating Equipment
Registration 2020-09-22 10-2160500 Method of forming wiring on side surface of substrate Micro LED Side Wiring
Registration 2020-11-11 10-2182584 LED display module Micro LED Side Wiring
Registration 2020-11-11 10-2179671 A substrate side deposition apparatus having a substrate mounting drum with improved cooling efficiency Micro LED Side Wiring
Registration 2020-11-11 10-2179672 Method of forming wiring on side surface of substrate Micro LED Side Wiring
Registration 2020-12-09 10-2191323 Automated substrate side deposition method Micro LED Side Wiring
Registration 2020-12-02 10-2188372 Substrate both sides deposition apparatus(2) Micro LED Side Wiring
Registration 2020-12-02 10-2188373 Substrate both sides deposition apparatus(3) Micro LED Side Wiring
Registration 2020-12-31 10-2199602 Exposure device for formation of substrate circuit pattern Micro LED Side Wiring
Registration 2021-01-20 10-2207602 Method of forming wiring on side surface of substrate Micro LED Side Wiring
Registration 2021-03-04 10-2225985 Automated substrate side deposition apparatus Micro LED Side Wiring
Registration 2021-03-04 10-2225986 Substrate side deposition apparatus(1) Micro LED Side Wiring
Registration 2021-03-30 10,964,868 USA_Patent3(LED display module) Micro LED Side Wiring
Registration 2021-03-30 10,964,509 USA_Patent2(Substrate side deposition apparatus) Micro LED Side Wiring
Registration 2021-07-02 10-2274884 Roll-to-roll sputtering equipment Double-sided sputter equipment
Registration 2021-02-26 6843445 Japan_Patent1(Method of forming wiring on side surface of substrate) Micro LED Side Wiring
Registration 2021-04-27 6875750 Japan_Patent2(Substrate side deposition apparatus) Micro LED Side Wiring
Registration 2021-03-16 6853588 Japan_Patent3(LED display module) Micro LED Side Wiring
Registration 2021-06-01 6892713 Japan_Patent6(Substrate Both Sides Deposition Apparatus) Micro LED Side Wiring
Registration 2021-07-01 I732530 Taiwan_Patent5(Method of forming wiring on side surface of substrate) Micro LED Side Wiring
Registration 2021-08-24 11,098,401 USA_Patent1(Method of forming wiring on side surface of substrate) Micro LED Side Wiring
Registration 2021-10-01 ZL201910693671.3 China_Patent2(Substrate side deposition apparatus) Micro LED Side Wiring
Registration 2021-09-27 6949381 Japan_Patent4(A device for depositing a metal film on a surface of a three-dimensional object) Semiconductor IC EMI Shield
Registration 2021-08-21 I737264 Taiwan_Patent6(Substrate Both Sides Deposition Apparatus) Micro LED Side Wiring
Registration 2021-11-30 11,186,907 USA_Patent6(Substrate Both Sides Deposition Apparatus) Micro LED Side Wiring