Develop History

6

Numbers of Development
  • svgsvg

    FCCL

  • svgsvg

    Vapor deposition equipment

  • svgsvg

    ITO metal Bezel

  • svgsvg

    Ag paste

  • svgsvg

    Solder ball

  • svgsvg

    EMI Film Metal Deposition

  • FCCL

    2000~2010

    Development of Sputtering and Dong-Mount Process

    01
  • Vapor deposition equipment

    2005~2011

    FCCL Cost Reduction Project

    02
  • ITO METAL BEZEL

    2005~2011

    ITO Film Metal Bezel Spurtering
    (merging with 3M, the equipment business Spin-off. Now TETOS)

    03
  • AG PASTE

    2014 ~ Present

    Cu dendrite surface Ag sputtering.
    (Heat radiation, conductive material)

    04
  • Solder ball

    2015 ~ Present

    Semiconductor Packaging (BGA Soldering) Material

    05
  • EMI Film Metal Deposition

    2017 ~ Present

    Metal Spurtering on Nano Fiber, Cupoil, etc. Surface
    (Semiconductor Shieldable Replacement, EMI Shielder)

    06