Contact Us
— | Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying the layer. |
---|---|
— | Increased reliability of semiconductor components by immersing non-plating products with a sputter |
— | Sputter method without transformation of raw material for various parts |
Application : Semiconductor Wafer Bumping RDL/UBM Process Cu Plating Process Cu Plating Equipment Composition Wafer Cu Plating Equipment 3D Design – Composition:
Simultaneous metal deposition on 3 sides of display board (side wiring technology) — Product Application ㆍSubstrate side wiring TV ㆍSubstrate/Ball/Deposition Simultaneous metal