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— | Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying the layer. |
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— | Increased reliability of semiconductor components by immersing non-plating products with a sputter |
— | Sputter method without transformation of raw material for various parts |
Simultaneous metal deposition on 3 sides of display board (side wiring technology) — Product Application ㆍSubstrate side wiring TV ㆍSubstrate/Ball/Deposition Simultaneous metal
R to R Sputter — Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers — Performance is given to