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— | Electrolytic and chemical reactions to the film surface in a plating solution |
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— | Plating of Laser Hall (PTH) in FPCB-circuit |
— | Spacial Layer Plating of FCCL |
— | Circuit diagram of touch panel |
— | Uniform sheet metal thickness control (0.15 μm ~ 200 μm ± 10%) |
— | Control of plated film quality (green size, Roughness, etc.) |
— | Plating can be done on both sides |
R to R Sputter — Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers — Performance is given to
Plastic Cored Solder Ball — Solder ball for semiconductor packaging(Plastic Cored Solder Ball) — Compared to competitors’ multi-layered plated films, manufacturing method