We are Creating · Co-working · Contributing
We are Creating · Co-working · Contributing
EMI Shield Sputter
Basic Configuration of Sputter (1Chamber)
— Sputtering Chamber + Carrier L/UL(Vacuum/Standby) + Baking Chamber + Cassette L/UL
| 01. Cassette L/UL 02. Carrier L/UL Robot 03. Baking Chamber 04. Carrier L/UL Vacuum Robot 05. High Vacuum Pump 06. Carrier Mounted Rotation Jig 07. Sputtering maintenance UT/Door 08. Sputtering Chamber 09. Medium Vacuum Pump/Chiller |
Comparison of Batch Rotation Sputtering Process
ㆍExisting Inline / Cluster Type
Multi Chamber Sputtering (3~5Chamber)
Since deposition thickness is thinner on the side than on the top of the chip and the deposition thickness becomes thick on the film side,
deposition film peeling-off or burr occur on the PKG corner parts in Pick * Place process.
ㆍTETOS Two-way Rotation Deposition Type
1 Chamber Rotation Sputtering
– Angle of 5~ 30˚ is generated during deposition with two-way rotation of
Carrier, which is advantageous for Package side
– Deposition thickness on the Top and the side is relatively uniform.
– Less falling of Corner deposition or less adhesion of deposition film.
– Short cleaning time and target replacement time with 1 chamber
Package EMI Shielding TEST Result
ㆍFIB Image of Other Companies(x10,000)
ㆍTETOS FIB Image(x10,000)
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