|01. Cassette L/UL|
02. Carrier L/UL Robot
03. Baking Chamber
04. Carrier L/UL Vacuum Robot
05. High Vacuum Pump
06. Carrier Mounted Rotation Jig
07. Sputtering maintenance UT/Door
08. Sputtering Chamber
09. Medium Vacuum Pump/Chiller
Since deposition thickness is thinner on the side than on the top of the chip and the deposition thickness becomes thick on the film side,
deposition film peeling-off or burr occur on the PKG corner parts in Pick * Place process.
– Angle of 5~ 30˚ is generated during deposition with two-way rotation of
Carrier, which is advantageous for Package side
– Deposition thickness on the Top and the side is relatively uniform.
– Less falling of Corner deposition or less adhesion of deposition film.
– Short cleaning time and target replacement time with 1 chamber
Screening/Radiator Film — Shielding/heat radiation film deposition — Replace traditional plating with sputtering. Gain quality and price competitiveness by diversifying and simplifying
Application : Semiconductor Wafer Bumping RDL/UBM Process Cu Plating Process Cu Plating Equipment Composition Wafer Cu Plating Equipment 3D Design – Composition: