We are Creating · Co-working · Contributing
We are Creating · Co-working · Contributing
R to R Sputter
R to R Sputter
| — | Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers |
|---|---|
| — | Performance is given to conductors, insulation, radiator, and electron absorption, depending on the deposition material |
| — | Used for ultra-fast manufacturing (thickness 0.001μm to 100 μm) |
| — | Low deviation from the vapour thickness enables high reliability |
| — | Can form flexible metal layers |
| — | ECO Green Deposition Method |
ㆍVacuum chamber
ㆍ Touch panel electrode
ㆍCOF circuit
ㆍNFC antenna
ㆍElectromagnetic masking film
Other Services
-
EMI Shield Sputter
Basic Configuration of Sputter (1Chamber) — Sputtering Chamber + Carrier L/UL(Vacuum/Standby) + Baking Chamber + Cassette L/UL 01. Cassette L/UL02. Carrier L/UL
-
Wafer Plating
Application : Semiconductor Wafer Bumping RDL/UBM Process Cu Plating Process Cu Plating Equipment Composition Wafer Cu Plating Equipment 3D Design – Composition:
