R to R Sputter

R to R Sputter

Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers
Performance is given to conductors, insulation, radiator, and electron absorption, depending on the deposition material
Used for ultra-fast manufacturing (thickness 0.001μm to 100 μm)
Low deviation from the vapour thickness enables high reliability
Can form flexible metal layers
ECO Green Deposition Method
ㆍVacuum chamber

ㆍ Touch panel electrode

ㆍCOF circuit

ㆍNFC antenna

ㆍElectromagnetic masking film

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