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— | Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers |
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— | Performance is given to conductors, insulation, radiator, and electron absorption, depending on the deposition material |
— | Used for ultra-fast manufacturing (thickness 0.001μm to 100 μm) |
— | Low deviation from the vapour thickness enables high reliability |
— | Can form flexible metal layers |
— | ECO Green Deposition Method |
Basic Configuration of Sputter (1Chamber) — Sputtering Chamber + Carrier L/UL(Vacuum/Standby) + Baking Chamber + Cassette L/UL 01. Cassette L/UL02. Carrier L/UL
Application : Semiconductor Wafer Bumping RDL/UBM Process Cu Plating Process Cu Plating Equipment Composition Wafer Cu Plating Equipment 3D Design – Composition: