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| — | Equipment to attract metallic/non metallic objects into film surfaces in vacuum chambers |
|---|---|
| — | Performance is given to conductors, insulation, radiator, and electron absorption, depending on the deposition material |
| — | Used for ultra-fast manufacturing (thickness 0.001μm to 100 μm) |
| — | Low deviation from the vapour thickness enables high reliability |
| — | Can form flexible metal layers |
| — | ECO Green Deposition Method |
R to R Plating — Electrolytic and chemical reactions to the film surface in a plating solution — Plating of Laser Hall
Simultaneous metal deposition on 3 sides of display board (side wiring technology) — Product Application ㆍSubstrate side wiring TV ㆍSubstrate/Ball/Deposition Simultaneous metal